ASML Holding N.V. in Veldhoven announced that a second customer has successfully performed an Extreme Ultraviolet Lithography (EUV or EUVL) endurance test during which wafer processing capability was proven of around 600 wafers within 24 hours, on a EUV system.
The endurance test was designed to simulate a production run and, similar to an earlier test in July which exceeded the 500 wafer per day requirement that ASML customers have set for the end of the year.
ASML President and Chief Executive Officer Peter Wennink told a webcast investor conference in New York that ASML is encouraged by the result of this second test. However, EUV-performance needs to be repeated on multiple days and multiple systems which is the goal of the availability improvement programs that will be executed throughout the remainder of the year.
ASML produces microelectronics and develops complex technology for high-tech lithography machines for the semiconductor industry.