NXP Pushes Car-to-X market with ew RoadLINK Solution

NXP Semiconductors N.V. announced that the second product from the RoadLINK range is now available. The TEF510x is a dual radio multi band RF transceiver for Car-to-X (C2X) applications which provides an optimized solution in one chip.

The chip has the flexibility to support global deployments and various system configurations.

The TEF510x RF transceiver meets Japanese 760Mz C2X requirements, US and European (5.9GHz) as well as Wi-Fi and DSRC (5.8GHz) specifications. It will be released for automotive production in 2015 and is expected to be available to consumers as early as 2016.

RoadLINK takes C2X communications to the next level by bringing safety-critical information to the driver significantly faster than current conventional applications can.

"We are launching the best performing C2X solutions in the market. It’s the only solution that has been field proven." According to Thomas Hinz, senior product marketing manager, RoadLINK, NXP Semiconductors "It’s fast, it works over extended distances and it has the features to fully realise the potential of C2X technology."

"NXP is dedicated to developing leading performance solutions to connect the car securely, improving road safety, reducing traffic congestion, ultimately creating smarter transport infrastructure."

Source: http://www.nxp.com

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